Hotmelts for automated packaging
21 February 2024
With automated packaging and palletising with hotmelts, Henkel Adhesive Technologies is presenting two innovative solutions for e-commerce applications at LogiMAT 2024.
With the Technomelt E-Com portfolio, the division supplies hot melt adhesive solutions for customised transport packaging and envelopes. This significantly increases the productivity of on-demand packaging technologies. With "automated, right-sized packaging", the size of the products to be packaged is recorded so that the shipping boxes and envelopes can then be precisely customised. By dispensing with filling material, material and transport costs can be significantly reduced and output increased considerably: up to 1,000 cardboard boxes can be packed per hour using the automated process.
Henkel's Technomelt adhesives are 100 per cent compatible with the paper recycling process in accordance with the guidelines of the European Paper Recycling Council (EPRC) and are certified by all leading machine and dispensing equipment manufacturers. The portfolio is available worldwide, ensuring short transport routes to customers.
Henkel Adhesive Technologies also offers an innovative solution for palletising: instead of large quantities of plastic film, hotmelts from the Technomelt Supra PS product range stabilise stacked goods during transport on pallets. The adhesive is applied to the packaged goods and prevents them from slipping. This ensures safe transport, enables higher stacking and reduces the use of stretch film by up to 90 per cent. In addition, intermediate layers can be dispensed with, which significantly reduces material costs and allows depalletising to be automated, thereby increasing process efficiency. A pallet demonstrates the palletising solution on site.
The hot melt adhesive is compatible with the recycling process in accordance with EPRC guidelines. It can be used to pack cartons, crates, plastic bottles, cans, multi-piece packaging as well as paper and plastic bags.
Henkel at LogiMAT 2024: Hall 4, Stand A53